Loodvrije soldeerbolletjes 0,30 mm 25.000 stuks voor elektronisch solderen
Merk: Pmtc
IVA inbegrepen (Excl. btw: 6,00€)
De loodvrije soldeerbolletjes 0,30 mm 25.000 st zijn een essentieel product voor elektronicaspecialisten die hoogwaardige materialen nodig hebben voor soldeer- en reballingprocessen. Deze loodvrije soldeerbolletjes zijn ontworpen om optimale prestaties te leveren bij de reparatie en productie van elektronische circuits.
Belangrijkste kenmerken:
- Diameter: 0,30 mm, ideaal voor nauwkeurig en gedetailleerd werk.
- Aantal: 25.000 stuks per pot, voldoende voor meerdere toepassingen.
- Samenstelling: 96.5% tin (Sn), 3.0% zilver (Ag), 0.5% koper (Cu), voor hoogwaardig loodvrij solderen.
- Fabrikant: Profound Material Technology, Taiwan, bekend om zijn kwaliteit in soldeermaterialen.
- Loodvrij: Voldoet aan milieu- en gezondheidsnormen door het gebruik van lood in het soldeer te vermijden.
Typische toepassingen:
- Reballing van BGA en andere elektronische componenten.
- Precisiesolderen op printplaten (PCB).
- Reparatie en onderhoud van elektronische apparatuur.
Compatibiliteit: Compatibel met soldeerstations en reballinggereedschap die soldeerbolletjes van 0,30 mm ondersteunen. Ideaal voor professionals die op zoek zijn naar betrouwbare en efficiënte materialen voor hun processen.
Deze pot met loodvrije soldeerbolletjes is een uitstekende keuze voor wie kwaliteit, betrouwbaarheid en naleving van milieunormen in elektronisch solderen zoekt. Hoewel dit artikel momenteel niet op voorraad is, is het raadzaam om toekomstige beschikbaarheid in de gaten te houden.
- Loodvrije soldeerbolletjes met een diameter van 0,30 mm
- 25.000 stuks per pot
- Samenstelling 96.5Sn-3.0Ag-0.5Cu voor hoogwaardig solderen
- Gemaakt door Profound Material Technology in Taiwan
- Ideaal voor reballing en professioneel elektronisch solderen
Klantvragen & Antwoorden
What applications is the 0.30 mm lead-free solder ball suitable for?
The 0.30 mm lead-free solder balls are mainly designed for reballing processes on high-density BGA components, such as those found in mobile phones, laptops and miniaturised electronic devices. Their size is ideal for work requiring precision and fine joints.
What is the composition and what advantages does the 96.5Sn-3.0Ag-0.5Cu alloy offer?
This alloy (96.5% tin, 3% silver, 0.5% copper) is standard in RoHS lead-free soldering and provides good wetting, superior mechanical strength and a lower likelihood of tin whisker formation compared with Sn-Cu-only alloys. It offers a melting point of around 217–219°C.
Are there any specific temperature requirements and compatibility considerations with BGA rework stations?
Yes, for this lead-free alloy, a thermal profile reaching between 235°C and 245°C should be used during the reflow phase. It is compatible with most BGA rework stations, provided they support these thermal ranges. It is not recommended for use with equipment not prepared for lead-free soldering.
What are the main differences compared with conventional leaded solder balls?
The main difference is the absence of lead, meeting RoHS regulations and making it more environmentally safe. However, lead-free alloy generally requires a higher soldering temperature (around 20°C higher) and shows slight differences in wetting and joint longevity.
Does the 25,000-unit jar require any special storage conditions or have an expiry date?
It is recommended to keep the balls in their original jar, in a dry place with <35% RH and at room temperature (<25°C), to prevent oxidation. If stored correctly, the shelf life is usually 1-2 years, although after that period the risk of oxidation or contamination increases.
What applications is the 0.30 mm lead-free solder ball suitable for?
The 0.30 mm lead-free solder balls are mainly designed for reballing processes on high-density BGA components, such as in mobile phones, laptops and miniaturised electronic devices. Their size is ideal for work requiring precision and fine joints.
What is the composition and what advantages does the 96.5Sn-3.0Ag-0.5Cu alloy offer?
This alloy (96.5% tin, 3% silver, 0.5% copper) is standard in RoHS lead-free soldering and provides good wetting, superior mechanical strength and a lower likelihood of tin whisker formation compared with Sn-Cu-only alloys. It has a melting point of around 217–219°C.
Are there any specific temperature requirements and compatibility considerations with BGA rework stations?
Yes, for this lead-free alloy, a thermal profile reaching between 235°C and 245°C should be used during the reflow phase. It is compatible with most BGA rework stations, provided they support these thermal ranges. It is not recommended for use with equipment not prepared for lead-free soldering.
What are the main differences compared with conventional leaded solder balls?
The main difference is the absence of lead, meeting RoHS regulations, which makes it safer for the environment. However, lead-free alloy generally requires a higher soldering temperature (around 20°C higher) and shows slight differences in wetting and joint longevity.
Does the 25,000-unit jar have any special storage conditions or shelf life?
It is recommended to keep the balls in their original jar, in a dry place with <35% RH and room temperature (<25°C), to avoid oxidation. If stored correctly, shelf life is usually 1-2 years, although after that period the risk of oxidation or contamination increases.
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